"White Papers" Canona, rozdział IV The economics of image sensors:
Consider, too, that an 8" silicon wafer usually yields 1000 to 2000 LSI (Large-Scale Integrated) circuits. If, say, 20 areas have defects, such as dust or scratches, up to 1980 usable chips remain. With 20 large sensors on a wafer, each sensor is an easy “target.” Damage anywhere ruins the whole sensor. 20 randomly
distributed dust and scratch marks could ruin the whole batch. This means that the handling of full-frame sensors during manufacture needs to be obsessively precise,and therefore they are more expensive.three or four times, but ten, twenty or more times as much as an APS-C sensor.
Of course, there is more to this topic. For example, the circuit pattern of a fullframe sensor is too large to be projected on the silicon wafer all at once; it requires three separate exposures (See page 53). This means that the number of masks and exposure processes is tripled. For now, appreciate that a full-frame sensor costs not
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